BlackBerry Z10 Gets Tear Down Listing Its Components & Chip Partners

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UBMTechInsights has done an amazing job of tearing down the BlackBerry Z10 with lots of pictures. The best part is that they list out all the device components used and how they stack up to the competition. What they found very interesting was that the device shares many of the same chips as the LTE Samsung Galaxy S3 which is interesting to see.

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Mostly we are seeing Qualcomm chips but here is the full listing:

Samsung K3PE0E000A – Multichip Memory – 2 GB Mobile DDR2 SDRAM
Samsung KLMAG2GE4A – Multichip Memory – 16 GB MLC NAND Flash, Controller
Qualcomm MSM8960 – Snapdragon S4 Baseband / Applications Processor
Qualcomm WCD9310 – Audio Codec
Qualcomm PM8921 – Power Management IC
Qualcomm RTR8600 – GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS
Texas Instruments WL1273L – Single-Chip 802.11a/b/g/n WLAN, Bluetooth, and FM
TriQuint TQP6M9017 – Dual-Band WLAN Module
RF Micro Devices RF7252 – CDMA/WCDMA BAND 2 Linear Power Amplifier Module
RF Micro Devices RF7303 – LTE/UMTS/CDMA BAND 3 Linear Power Amplifier Module
Inside Secure SECUREAD IC5C633I4- NFC Solution Module
Avago ACPM-5017 – LTE Band XVII Power Amplifier
Avago ACPM-7051 – Quad-Band GSM / W-CDMA Bands I & V Power Amplifier
Sony CXM3582UR – SP10T Antenna Switch
ST Microelectronics LIS3DH – MEMS Accelerometer
STMicroelectronics LSM330DLC – 3D Accelerometer & 3D Gyroscope
Synaptics Clearpad 3203 – Capacitive Touchscreen Controller

This clearly shows that Texas Instruments has really been replaced with Qualcomm for these devices compared to the PlayBook. Also of interest is the tie in with Samsung. Check out all of the images and tear down here and let us know if you spot anything interesting!

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